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自動(dòng)化邊緣曝光系統(tǒng)
模型2012SM
2012SM型自動(dòng)邊緣曝光系統(tǒng)為使用標(biāo)準(zhǔn)陰影掩模技術(shù)的邊緣珠去除提供了一種經(jīng)濟(jì)高效的方法。 設(shè)計(jì)用于容納8“到300mm的晶片,該工具具有自動(dòng)FOUP裝載。 掩模和基材切換可以快速且容易地實(shí)現(xiàn),從而增加該生產(chǎn)工具的通用性和高產(chǎn)量。
Automated Edge-Bead Exposure SystemThe Model 2012SM Automated Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.
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